Model:AS-261-0-02
Type:Automated Semiconductor Assembly System
Reflow Speed:Up to 1000 components per minute
Bonding Capacity:Supports fine-pitch BGA and CSP packages
Power Supply:230V, 50/60Hz
Maximum Process Temperature:450°C
Cooling System:Water-cooled for precision temperature control
Automation Level:Fully automated with operator interface
Dimensions:960mm x 1200mm x 1400mm
Weight:Approximately 1200kg
Introducing the K&S AS-261-0-02, a marvel in semiconductor manufacturing technology, specifically engineered for the assembly of microchips with unparalleled precision. This state-of-the-art assembly station is designed to handle up to 261 chips in a single cycle, ensuring high throughput without compromising on quality. Its ±0.02mm assembly accuracy sets new standards for precision in the industry, guaranteeing that each component assembled meets the highest level of performance.
Featuring a fully automated process, the AS-261-0-02 streamlines the assembly line, reducing manual intervention and increasing efficiency. With a cycle time of less than 0.5 seconds per chip, this station is a game-changer in speeding up production lines while maintaining meticulous attention to detail.
Temperature control is another highlight of this station. It comes equipped with precision temperature regulation, ensuring that soldering conditions are always optimal, leading to better bonding strength and reliability of the assembled components.
Incorporating the latest in software integration, the AS-261-0-02 seamlessly works with industry-standard assembly software. This compatibility enhances its usability across different manufacturing environments, making it a versatile tool for engineers and technicians alike.
Efficiency is not compromised when it comes to power consumption. With a low power draw of 200W, the AS-261-0-02 operates with minimal energy use, contributing to sustainable practices and cost savings on operational expenses.
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